BOCSTORY_CHIP_SUBTITLE - Subtitle for BOC Story chip

SAP data element BOCSTORY_CHIP_SUBTITLE has the title "Subtitle for BOC Story chip".
It is part of development package CA_CFND_BOC_DDIC in software component CA-GTF-VDM-BOC. This development package consists of objects that can be grouped under "Cloud Foundation:BOC Story -DDIC package".

Properties of data element BOCSTORY_CHIP_SUBTITLE

Property
DomainCHAR255
Data TypeCHAR
Length255
Decimals0
Output Length255
Supports lower caseNo
Conversion Routine
Short DescriptionDesc
Medium DescriptionDescription
Long DescriptionDescription

Tables with fields of type BOCSTORY_CHIP_SUBTITLE

The data element BOCSTORY_CHIP_SUBTITLE is used by fields in the following tables.

Privacy Policy