CSCP_COMP_LVL - Material completion level

SAP data element CSCP_COMP_LVL has the title "Material completion level".
It is part of development package CSCP in software component PP-SOP-DRP. This development package consists of objects that can be grouped under "Semiconductor Planning".

Properties of data element CSCP_COMP_LVL

Property
Domain	CSCP_COMP_LVL
Data Type	NUMC
Length	2
Decimals	0
Output Length	2
Supports lower case	No
Conversion Routine
Short Description	CompLvl
Medium Description	Comp. Level
Long Description	Material completion level

Tables with fields of type CSCP_COMP_LVL

The data element CSCP_COMP_LVL is used by fields in the following tables.

Table		Development Package
MARA_PRC	Process Root Records Of OTC 194, Table MARA	MDC_MAT_MODEL	Master Data Consolidation: Material Data Model
MARA_SRC	Source Root Records Of OTC 194, Table MARA	MDC_MAT_MODEL	Master Data Consolidation: Material Data Model
MARA	General Material Data	MG	Application development R/3 material master prior to 3.0
MARA_TMP	File for Incorrect Data in Direct Input	MGAD	Data Transfer R/3 Material Master as of 3.0
MVRA	Cross-version fields for MARA	MGVERS	Material version in material master
TCSCP_COMP_LVL	Material completion levels (including their sequence)	CSCP	Semiconductor Planning
TCSCP_COMP_LVLT	Material completion level (Description)	CSCP	Semiconductor Planning